2013-08-14
As LED producers continue to move to chip-on-board designs, the size of light-emitting surfaces is shrinking.
LEDs Magazine recently ran a survey of the historical movement of LEDs from separate dies to packaged arrays -- so-called chip-on-board (CoB) packages. The article devotes special attention to the evolution of connectors as the industry struggled to adapt to the wide variety of CoB products on the market (now well over 50 of them, according to the magazine).
The move to CoB has been under way for two years or so. What we have seen in recent months is the introduction of CoB designs with smaller light-emitting surfaces (LES). By shrinking the light source, these products are better able to address the directional applications for which the earlier, wide-area emitter CoB designs were not well suited.
Here are a few of the small-LES products that have been introduced recently.
Much of the innovation in LED engine development is happening in the area of CoB arrays. Efficacies are rising; color binning, already simplified by the use of multiple LEDs, is improving; some suppliers are innovating in substrates. Both more variety and lower prices are likely to result.
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— Keith Dawson
, Editor-in-Chief, All LED Lighting